**JM38510/13501BGA: A Technical Overview of the Military-Grade Microcircuit**
The **JM38510/13501BGA** represents a pinnacle of reliability and performance in the realm of military-grade integrated circuits. As part of the established 5400 series, this specific device is a radiation-hardened, high-reliability Schottky TTL logic circuit designed to operate flawlessly in the most demanding environments on Earth and in space. Its designation follows a strict military part numbering system, where "JM" indicates a ceramic microcircuit meeting JAN (Joint Army-Navy) standards, "38510" specifies the military drawing number, and "13501BGA" denotes the specific device type and its Ball Grid Array (BGA) package.
The core of this microcircuit's value lies in its **exceptional resilience to extreme conditions**. It is manufactured and tested to comply with MIL-PRF-38535, the performance specification for integrated circuits. This mandates rigorous screening and quality assurance processes, including burn-in, temperature cycling, and hermeticity tests, ensuring functionality across a **specified operating temperature range of -55°C to +125°C**. This makes it indispensable for critical applications in aerospace, defense, and satellite systems where failure is not an option.
The **BGA (Ball Grid Array) package** is a critical feature of this component. Unlike older packaging types, the BGA offers a significantly higher pin count in a smaller footprint, which is crucial for complex modern systems. More importantly, it provides superior thermal and electrical performance. The solder balls underneath the package offer shorter lead paths, reducing inductance and allowing for higher-speed operation, which is vital for advanced digital processing tasks in radar, communications, and guidance systems.
Furthermore, these devices are specifically **hardened against radiation effects**, including Single Event Latch-up (SEL) and Total Ionizing Dose (TID). This protection is paramount for ensuring long-term functionality in space, where cosmic rays and charged particles can disrupt or permanently damage non-hardened electronics. The materials and construction are also designed to be **hermetically sealed**, preventing any moisture or contaminants from penetrating the package and degrading the silicon die over time.
In application, the JM38510/13501BGA is a fundamental building block in systems that demand absolute certainty. It can be found at the heart of flight control computers, missile guidance systems, satellite payload controllers, and other mission-critical electronic assemblies. Its guaranteed performance and longevity under stress provide systems engineers with a trusted component to build upon, mitigating risk in multi-million dollar projects.
ICGOODFIND: The JM38510/13501BGA is more than just a component; it is a testament to engineering for extreme reliability. Its adherence to stringent military standards, advanced BGA packaging, radiation hardening, and hermetic sealing make it a cornerstone technology for critical aerospace and defense applications where performance must be guaranteed against all odds.
**Keywords:** Military-Grade, Radiation-Hardened, Hermetically Sealed, BGA Package, High-Reliability
